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BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone

BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone

$ 6.85

Availability: 42 in stock
  • Material: Cast Iron
  • Model Number: BGA Direct Heating Reballing Stenci
  • MPN: Does not apply
  • Usage: Home DIY
  • Brand: Unbranded
  • application: Samsung HUAWEI HTC MTK Android
  • Condition: New
  • Item must be returned within: 30 Days
  • is_customized: No
  • Type: Reballing Stencil
  • Return shipping will be paid by: Buyer
  • Refund will be given as: Money Back
  • All returns accepted: Returns Accepted
  • Restocking Fee: No

    Description

    PHONEFIX 12pcs Full Set BGA Reballing Stencil Template for Samsung Huawei MTK LG Xiaomi, Mobile Phone Rework Repair BGA Reballing Stencils soldering assistant, it is used for professional reballing operation on Samsung Huawei LG MTK Xiaomi Oppo Vivo BGA IC chips.